Conductive Wire Glue/Paint - NO Soldering Iron

Product Information

Because results are affected by the adhesive thickness and the temperature at which the testing is done.

TE Connectivity empowers engineers by designing and manufacturing sensor and connectivity solutions for our increasingly connected world. If you would like to see a list of the metals I have tried and the results along with the latest update on Conductive Glue Experiments, you can see them at: http://www. In fact, in the European Union, the Restriction of Hazardous Substances Directive (RoHS) prohibits the use of lead in consumer electronics. It can also be used as a solder replacement for bonding heat-sensitive electronic components, or for making conductive connections where soldering is not an option, such as when bonding to glass, soft metals, or plastics.

These B-stage formulas have extraordinary toughness, good storage stability and cure at moderate temperatures. After some experimentation, I have found that mixing the Carbon Graphite and liquid tape in a 1-1/2 to 1 ratio by volume, produces the lowest resistance. Bare Conductive Electric Paint has a surface resistivity of approximately 55 ohms/square at 50 microns layer thickness. For tougher joins that require extra adhesion coat the join with a thin layer of super glue after the join is dry.

In addition the adhesives are much more flexible than solder and are therefore better able to withstand vibrations. Two part systems offer convenient mix ratios, minimize thermal stress and are well suited to bond heat sensitive substrates. Our tapes can be supplied either single sided or double sided in a roll format or as bespoke die cut shapes to match your exact product profile. Paste viscosity materials have fast tack free speed, flexibility and high temperature resistance up to 400°F for use in bonding, gasketing, EMI/RFI shielding.These advanced conductive adhesives provide excellent adherence to a range of surfaces where other types of glue or epoxy are unsuitable.

ACAs are then suited for use in some specific circuit board applications such as flip-chips and RFID assembly. Whether that’s using snap cure, heat cure, room-temperature cure, or dual component conductive adhesives.These adhesives are used, for example, in many sensitive structures on circuit boards, such as LCD connections or contacting flexible PCBs, or for bonding antenna structures on RFIDs. These adhesives are used, for example, in many sensitive structures on circuit boards, such as LCD connections or for contacting FPC (flexible printed circuits).